In the precision field of electronic packaging, the selection of sintered silver paste directly determines the upper limit of product performance and long-term reliability. In response to core application requirements, this articl...

Jufeng Innovative FC-100U Copper Sinter Paste: An Efficient, Reliable, and Cost Effective Packaging SolutionIn today's industrial production field, the requirements for packaging solutions are becoming increasingly stringent, and ...

In the field of power semiconductor packaging, with the widespread application of wide bandgap materials such as silicon carbide (SiC) and gallium nitride (GaN), higher requirements have been put forward for interconnect materials...

We are pleased to announce that we will participate in CIMREC 2025 in Chengdu, China.Booth: 3B228Date: July 9-11, 2025Chengdu Century City New International Convention and Exhibition CentreWelcome to our booth to learn about our l...

Shenzhen Jufeng Solder Co., Ltd. launched a new series of pressure sinter copper products at the PCIM Europe exhibition, with the main product being Jufeng FC-100U, which is a new sintered material with high thermal conductivity a...

Welcome to visit our booth at PCIM Europe in Nuremberg, Germany...

Overcoming the storm and welcoming the dawn. In 2024, we, the people of Juli, forge ahead in the face of challenges, with our unyielding will and firm steps, jointly write a chapter of tenacity and courage. Here, on behalf of Juli...

Large-area silver sintering process: innovative technology in packagingLarge-area silver sintering technology is becoming an innovative focus in the packaging industry due to its lead-free environmentally friendly characteristics ...

At present, the new energy vehicle industry is developing at a rapid pace, leading to unprecedented challenges for key components such as main inverters, control systems of electric vehicle motor , DC-DC converters, car chargers a...

Welcome to visit our booth at PCIM Europe in Nuremberg, Germany...